Today’s electronic devices have become smaller in size and deliver more power than ever before, which means that they typically run at higher temperatures. The main issue affecting such devices is removing that excess heat from the sensitive components since performance is only maintained when the heat is efficiently dissipated. Thermally conductive potting compounds and encapsulates are extremely important materials in that effort to control heat build-up in an electronic assembly. The formulations based on epoxy, urethane or silicone matrices are used to bond heat sinks, encapsulate power supplies and individual components. The addition of NAFEN™ nanofibers can improve the thermal conductivity of potting compounds and encapsulates by establishing heat conducting networks in a chosen matrix.
The electronic components can also be very sensitive to the impact of electromagnetic impulses. For such sensitive electronics or sensors, NAFEN™ can provide increased dielectric insulating properties in the materials used to encase the electronics, or in the films, adhesives and coatings used to encapsulate them.
NAFEN™ enhanced materials have great potential for improving the performance of electronic devices, such as solar cells, Li-ion batteries, supercapacitors, field-effect transistors, diodes, and sensors.
Potting compounds &encapsulants
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 685213